ORIGINAL RESEARCH
The Effect of Flax Seed Dressing with Biopreparations, Chitosan, and its Derivatives on Fungal Communities in Soil
Katarzyna Wielgusz1, Aleksandra Andruszewska1, Elżbieta Pląskowska2, Wojciech Szewczyk3, Jan Bocianowski4, Zbigniew Weber5
 
More details
Hide details
1Department of Breeding and Agronomy of Fibrous Plants, Institute of Natural Fibres and Medicinal Plants,
Wojska Polskiego 71B, 60-625 Poznań, Poland
2Department of Plant Protection, Wrocław University of Environmental and Life Sciences,
Plac Grunwaldzki 24A, 50-363 Wrocław, Poland
3Department of Forest Phytopathology, Poznań University of Life Sciences,
Wojska Polskiego 71C, 60-625 Poznań, Poland
4Department of Mathematical and Statistical Methods, Poznań University of Life Sciences,
Wojska Polskiego 28, 60-637 Poznań, Poland 5Department of Phytopathology, Poznań University of Life Sciences, Dąbrowskiego 159, 60-594 Poznań, Poland
 
Pol. J. Environ. Stud. 2011;20(1):215–224
 
KEYWORDS
ABSTRACT
The effect of flax seed dressing with biopreparations, chitosan, and its derivatives on fungal communities in soil was evaluated. Biopreparation organisms consisted of: Pseudomonas aureofaciens, P. fluorescens, Pythium oligandrum, a mixture of photosynthetic and Lactobacillus bacteria, and unidentified yeasts and fungi. Chitosan and its derivative active ingredients were used: chitosan microcrystalline, chitosan acetate, and chitosan oligomers. Untreated flax seeds and seeds dressed with Zaprawa Oxafun T 75 DS fungicide containing carboxin and thiram active ingredients were used for controls. In general, Pythium oligandrum caused a greater decrease in soil fungal colony-forming units (cfu) than the Zaprawa Oxafun T 75 DS fungicide and all other preparations tested. Pseudomonas aureofaciens and P. fluorescens generally produced similar decreases in soil fungal cfu compared to fungicide controls. Chitosan and its derivatives almost always caused a decrease in fungal cfu, but these decreases were less pronounced than that in fungicide controls.
eISSN:2083-5906
ISSN:1230-1485